When subject to certain conditions, some materials may release volatile gases, a problem for hermetic components that require a carefully maintained internal atmosphere. These outgassed compounds can negatively affect the reliability of electronic components, reducing the lifespan of your equipment. It’s therefore important to understand the amount and types of outgassed species your device may be subjected to.
ORS has developed a glass ampoule sealing technique that can trap outgassed substances from a variety of organic and inorganic materials. This test provides both a qualitative and quantitative analysis of these outgassed compounds and can be used to plot outgassing over time and at various temperatures, offering information about long-term device aging.
The material in question is sealed in a clean and dry glass container called an ampoule.
The ampoule is backfilled with a gaseous mixture that includes helium, hydrogen, and other gases.
The ampoule is sealed under vacuum conditions and subject to thermal stress.
The temperature will trigger outgassing from the material within the ampoule. In other words, the material will react to the extreme temperature and release a new gas into the internal atmosphere.
At this point, IVA® or GC/MS is used to identify the new gases, giving a complete picture of the internal atmosphere under the new conditions.
Reliability Testing for a Wide Range of Products, Equipment and Industries
Although material outgassing characterization was initially developed to assist manufacturers in the microelectronic and optoelectronic industries, it can be applied to many others. Countless industries may be invested in studying and preventing any problems that might occur over the lifespan of their equipment and products.
Each element of your equipment may require a detailed approach.
Epoxy cure cycle
Adhesive moisture content
Hydrogen desorption from Kovar packages and Au/Ni plating
Raw material outgassing
Chemical reaction by-products
Bake out studies
We can Help You
Screen material performance and compatibility to select suitable products.
Compare suppliers for material performance and preparation (i.e. adhesives cure cycle, etc.).
Characterize the stability of materials under thermal stress (i.e. curing, burn-in, thermal cycling, environmental tests, etc.).
Trace failure sources by knowing the outgassing signature of each material present in the cavity of a device.